bga

基本解释

• (ball grid array, 球状矩阵排列)

同根派生

英汉例句

• Fitting option BGA nozzle ensures excellent result and efficient.
  选购专用BGA风咀,使拆焊效果更佳及操作更快捷。
• Desirable for high-performance Ball Grid Array (BGA) package.
  高性能球形焊点阵列封装需要倒装焊。
• This method meets the needs of the on-line test of BGA coplanarity.
  该测量方法可以满足BGA(球脚阵列)封装引脚尺寸的实时在线检测的需要。
• BGA measurement is measured for inside solder point.
  BGA量测以最内侧焊点为量测依据。
• This procdure provides instruction for lead free BGA reballing process.
  该程序为无铅。