bevel angle

基本解释

Nearly any bevel angle can be machined into the wafer which remains after etching.
显然，任何斜角都能够加工到晶片内，并在蚀刻之后保留。
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According to current specification, the bevel angle is only based on experienced value and a complete calculation method is not available.
排汽管斜切口出流时的偏转角，按现行规范只有一点经验值而缺少完整的计算方法。
The effects of choosing lapping bevel angle during testing semiconductor devices and LSI chips by spreading resistance technique on measurement accuracy have been investigated in this paper.
讨论了在检测半导体器件和集成电路芯片时，不同研磨倾斜角度对扩展电阻量值的影响。
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