flip chip bonding
基本解释
- 倒装焊接
英汉例句
- To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景。 - With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
双语例句
词组短语
- Direct flip -chip bonding 直接倒装芯片接合
- Flip -chip-bonding equipment 倒装焊设备
- ultrasonic flip -chip bonding 超声倒装焊
- thermosonic flip -chip bonding 热超声倒装键合
- flip -chip-bonding technique 倒装焊技术
短语
专业释义
- 倒装式接合（法）
- 倒装焊接（法）