flip-chip

基本解释

Flip Chip technology is a typical application.
倒装芯片技术就是其中一个典型应用。
As an electric current passes through, the Joule heating and electromigration effects occur in the flip chip solder bumps.
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。
A summary of developmental work done in the field of single pass high reliability Flip Chip Reflow Encapsulants.
关于单遍高可靠性倒装片回流密封剂领域研发工作成就的综述。
The current crowding effect and temperature distributions in flip chip solders are discussed.
本研究亦讨论在覆晶焊点中之电流聚集效应及其温度分布。
Delamination at the underfill/chip interface in a flip chip on board (FCOB) assembly was investigated through MSC.
采用通用有限元软件MSC.