ic fabrication process

基本解释

The affection factors and causations generating process antenna effect (PAE) in the IC fabrication process are analyzed.
天线效应（PAE）是超深亚微米IC设计后端设计流程中的一个关键问题。
The stochastic nature of the IC fabrication process and the resulting difficulties in the process control are described.
本文说明了IC生产工艺的随机性及其给工艺控制和决策带来的困难。
This paper reports a buried channel structure for low power transverse voltage type IC pressure transducer. The fabrication and process computer simulation has been completed successfully.
本文提出一种低功耗埋沟式横向电压型集成压力传感器结构，并根据精确的工艺模型成功地进行了工艺计算机模拟程序和制作。