multilayer printed circuit board

基本解释

Black oxidation technology for copper in multilayer printed circuit board was introduced.
介绍了多层印制线路板内层铜墙表面的黑氧化技术。
The fabrication procedure of two kinds of microwave multilayer printed circuit board filled with ceramic particles is briefly introduced.
简单介绍两种陶瓷粉填充微波多层印制板的制造工艺流程。
Adhesive sheet with base used for flexible printed circuit board, method for producing same, multilayer flexible printed circuit board, and rigid-flex printed circuit board.
用于挠性印刷线路板的具有基材的粘合片，其制造方法，多层挠性印刷线路板和挠性-刚性印刷线路板。
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