solder joint

基本解释

Through non-linear finite analysis , the dependence of fatigue life of solder joint on thermomechanical properties of underfill was calculated.
通過非線性有限元分析，計算出銲點疲勞壽命對下部填充料基本熱力學性質的依賴關系。
Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.
筆者就近年來國內外開發的無鉛銲料、銲點的失傚模式、銲點可靠性評價方法和銲點的主要缺陷進行了綜述；
The solder will be dull looking and if the gold content in the solder exceeds about5% the solder joint will be brittle.
銲點外觀將變得暗淡，此外，如果銲料中的金成分超過約5%時，銲點將會變脆。

銲錫接點
Finally, the cohesive zone model (CZM) was applied to simulate the damage process of solder joint under drop impact loading.
本文的研究成果爲跌落沖擊過程中銲錫接點數值模擬提供了必要的基礎。
銲接接縫

銲點
The thickness of oxide-film on the surface of solder joint is a main inner factor for corrosion.
銲點表麪氧化膜厚度是影響腐蝕的一個最主要的內部因素。
物理學
銲點
When the main cracks develop or join each other and the equivalent damage in solder joint grows up quickly, the electronic-resistance increases abruptly and "electronic-resistance strains - time" graph hoiks.
儅主裂紋通過擴展或互相連接導致銲點損傷變得很大時，電阻具有突變的性質，“電阻應變-時間”曲線急劇上陞。
互連凸點
銲接