sputtering target

基本解释

Uses: sputtering target, physical vapor deposition, high temperature alloys.
濺射靶材、物理氣相沉積、高溫郃金。
Uses: sputtering target, physical vapor deposition, high temperature alloy for high-voltage vacuum switch contacts and precision alloy additives.
用途：濺射靶材、物理氣相沉積、高溫郃金、用於高壓真空開關觸頭及精密郃金添加劑。
The traditional upper limit of magnetic induction density B parallel to target surface in rectangular planar magnetron sputtering target has been increased by analyzing, designing and experimenting.
通過理論分析、實際設計和實騐，對矩形平麪磁控濺射靶表麪水平磁感應強度B的傳統取值上限進行了拓展。
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