sputtering equipment

基本解释

This paper presented a RF cylindrical magnetron sputtering equipment developed in our institute and the technique for sputtering films.
本文介紹了我所研制的RF同軸磁控濺射裝置及成膜技術。
Comparing with general sputtering method, this equipment has the advantages of decreasing the sputtering voltage and increasing the rate of deposition obviously.
與普通濺射方法相比，本設備的優點是：濺射電壓大大降低，而澱積速率提高很多。
A new magnetron sputtering equipment for coating microparticles was designed and fabricated according to the characteristic of the magnetron sputtering method and powder particles.
本論文根據磁控濺射及粉躰顆粒的特點，設計竝研制了一套微顆粒磁控濺射鍍膜設備；