单词盒子

wafer-level

W 开头单词

基本解释

  • n.圆片级

同根派生

     

英汉例句

  • One should cover the resistance with metal layer, to avoid the damaged during the wafer level testing.
    用金属覆盖电阻,避免wafer级测试时的损伤。
  • Structure designing and key processing technologies for wafer level package(WLP) were studied.
    对圆片级封装(WLP)的结构设计和关键工艺技术进行了研究;
  • Electrostatic bonding is an important encapsulating means for the materials at the chip or wafer level.
    静电键合是片状材料封接的一种重要手段，讨论了玻璃在电场作用下的键合过程。
  • Research of gold bump for wafer level package
    用于圆片级封装的金凸点研制
  • Ultrathin Wafer Level Chip Size Package Technology
    超薄型圆片级芯片尺寸封装技术