wafer dicing saw
基本解释
- [电子、通信与自动控制技术]切片锯
英汉例句
- The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
双语例句
词组短语
- wafer r dicing saw 切片锯
- dicing saw wafer scriber 划片机
短语
专业释义
- 切片锯